Title:
COPOLYMER LATEX FOR USE IN DIP MOLDING, COMPOSITION FOR USE IN DIP MOLDING, AND DIP-MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2005187544
Kind Code:
A
Abstract:
To provide a copolymer latex for use in dip molding, high in a degree of whiteness and excellent in touch feeling, tensile strength, elongation, and oil resistance and to provide a dip-molded product.
The copolymer latex for use in dip molding is one obtained by polymerizing in an emulsion a monomer mixture comprising 50 to 80 wt.% 1,3-butadiene, 15 to 50 wt.% acrylonitrile, 0 to 10 wt.% ethylenically unsaturated carboxylic acid monomer, and 0 to 35 wt.% ethylenically unsaturated monomer copolymerizable therewith, wherein the concentration of 4-cyanocyclohexene remaining in the copolymer latex is not higher than 500 ppm based on the solid content of the copolymer latex.
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Inventors:
TAKEDA FUMITOSHI
FUJIWARA WATARU
MATSUYAMA TAKASHI
JITSUMEN HIROSHI
FUJIWARA WATARU
MATSUYAMA TAKASHI
JITSUMEN HIROSHI
Application Number:
JP2003428172A
Publication Date:
July 14, 2005
Filing Date:
December 24, 2003
Export Citation:
Assignee:
NIPPON A & L KK
International Classes:
A41D19/00; B29C41/14; C08F2/26; C08F220/04; C08F220/44; C08F236/06; C08L9/04; B29K9/00; B29L31/48; (IPC1-7): C08F236/06; A41D19/00; B29C41/14; C08F2/26; C08F220/04; C08F220/44; C08L9/04