Title:
COPPER ALLOY FOR ELECTRICAL AND ELECTRONIC PART, AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JP2522629
Kind Code:
B2
Abstract:
PURPOSE: To provide a copper alloy for electrical and electronic parts, having high thermal stability as well as high strength and high elongation percentage without deteriorating electric conductivity.
CONSTITUTION: A copper alloy, having a composition consisting of, by weight, 0.5-2.4% nickel (Ni), 0.1-0.5% silicon (Si), 0.02-0.16% phosphorus (P), 0.02-0.2% magnesium (Mg), and the balance copper (Cu), is melted and cast into an ingot. The ingot is hot rolled at 750 to 950°C and cooled rapidly. Cold rolling, annealing, and air cooling are repeated until the desired thickness is reached. Subsequently, final cold rolling is performed. Then, tension-annealing treatment is carried out at 300 to 600°C for 5 to 30 min.
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Inventors:
IN YOTSUPU FUAN
YAN GIRU KIMU
YAN GIRU KIMU
Application Number:
JP12292993A
Publication Date:
August 07, 1996
Filing Date:
May 25, 1993
Export Citation:
Assignee:
PUNSAN CORP
YAN GIRU KIMU
YAN GIRU KIMU
International Classes:
C22C9/06; C22F1/00; C22F1/08; H01L23/48; (IPC1-7): C22C9/06; C22F1/08; H01L23/48
Domestic Patent References:
| JP2301535A | ||||
| JP63111151A | ||||
| JP6144142A | ||||
| JP2270945A | ||||
| JP314901B2 | ||||
| JP418016B2 |
Attorney, Agent or Firm:
Kabazawa Xiang (2 people outside)