Title:
COPPER ALLOY FOR ELECTRICAL AND ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP3470889
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a copper alloy for electrical and electronic parts excellent in proof stress, electroconductivity, spring critical value, stress relaxation resistance and bending workability and moreover excellent in Sn plating properties.
SOLUTION: This copper alloy for electrical and electronic parts contains, by mass, 0.5 to 2.4% Fe, 0.02 to 0.1 % Si, 0.01 to 0.2% Mg, 0.01 to 0.7% Sn and 0.01 to 0.2% Zn, and also contains <0.03% P, ≤0.03% Ni and ≤0.03% Mn, and the balance Cu with inevitable impurities. If required, the alloy contains 0.0005 to 0.015% Pb and/or one or two or more kinds among Be, Al, Ti, V, Cr, Co, Zr, Nb, Mo, Ag, In, Hf, Ta and B by ≤1% in total.
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Inventors:
Yukiya Nomura
Application Number:
JP2000207566A
Publication Date:
November 25, 2003
Filing Date:
July 07, 2000
Export Citation:
Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO
International Classes:
C22C9/00; C22C9/01; C22C9/02; C22C9/06; H01R13/03; (IPC1-7): C22C9/00; C22C9/01; C22C9/02; C22C9/06; H01R13/03
Domestic Patent References:
| JP4358033A | ||||
| JP10130755A | ||||
| JP5311288A | ||||
| JP2141562A | ||||
| JP5311278A | ||||
| JP2232327A | ||||
| JP10265874A | ||||
| JP11199954A | ||||
| JP718356A | ||||
| JP11222641A |
Attorney, Agent or Firm:
Kaoru Komoto