To provide a copper alloy for electronic equipment, excellent in strength, electric conductivity, bendability, and adhesion of an oxide film.

This copper alloy has a composition consisting of, by weight, 0.05-0.4% Cr, 0.03-0.25% Zr, 0.06-2.0% Zn, and the balance Cu with inevitable impurities and containing, if necessary, 0.1-1.8% Fe and 0.1-0.8% Ti or further containing, if necessary, 0.01-1.0%, in total, of one or more elements among Ni, Sn, In, Mn, P, Mg, and Si. Moreover, in this copper alloy, the size of inclusions is ≤30μm and the number of inclusions of 0.5-30μm is regulated to <100 pieces/mm2.