Title:
COPPER ALLOY FOR LEAD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5461026
Kind Code:
A
Abstract:
PURPOSE: To provide the title copper alloy with good workability, superior heat resistance, high electrical conductivity, etc. obtd. by adding predetermined amts. of Sn and Zr to Cu.
CONSTITUTION: The copper alloy consists of, by wt., Sn; 0.1W0.5%, Zr;0.01W 0.09% and the blance Cu. This alloy is easily melted and cast into a uniform material. It is also easily worked by hot or cold rolling, etc. and has superior punchability and bending characteristics. Fabrication of a semiconductor device is facilitated by this alloy.
Inventors:
SHIRAISHI HAJIME
SAWADA KAZUO
YAMANAKA SEISAKU
SAWADA KAZUO
YAMANAKA SEISAKU
Application Number:
JP12789577A
Publication Date:
May 17, 1979
Filing Date:
October 24, 1977
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L23/48; C22C9/00; C22C9/02; C22F1/00; C22F1/08; (IPC1-7): C22C9/02; H01L23/48