PURPOSE: To produce a copper base material for electronic parts having improved oxidation resistance and high joining strength by forming an Ag diffusion layer in which Ag is diffused into a grain boundary of the surface of a copper alloy parent material on the surface of the copper alloy parent material and further forming an Ag layer on the surface of the Ag diffusion layer.
CONSTITUTION: After Ag plating is applied to the surface of a copper alloy parent material (for example, Cu and 2% Sn-0.2% Ni-0.05% P-0.15% Zn), the Ag is diffused into a grain boundary of the parent material to form an Ag diffusion layer by heat treatment. Next, by applying rolling, an Ag layer is formed on the surface of the Ag diffusion layer so that its film thickness may be at least 0.04μm. In this way, the deterioration of the surface due to oxidation is notably restrained to improve oxidation resistance, allowing a copper base material for electric parts having high joining strength to be obtained.
KUSUNOKI TAKU
HARUYAMA MITSURU
WADA NAOTAKE
KUBOZONO KENJI
KURITA TOSHIHIRO
TAMURA YOSHIO
NOGUCHI HIROYUKI
MITSUBISHI ELECTRIC CORP
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