Title:
COPPER-BASED SINTERED SLIDING MATERIAL AND MULTI-LAYER SINTERED SLIDING MEMBER
Document Type and Number:
Japanese Patent JP2003089831
Kind Code:
A
Abstract:
To decrease the hostility to a mating material by producing a scraping effect on a local adhesive substance on a sliding surface, also to improve the wear resistance of the sliding surface itself, and further to improve seizure limit by suppressing frictional heat due to hard phases.
As nonmetallic particles consisting of one or more kinds among fine-grained oxides, carbides and nitrides, shock resistant ceramics consisting of SiO2 and/or two or more kinds among SiO2, Al2O3, LiO2, TiO2 and MgO are dispersed in amounts of 0.05 to <0.5 wt.% into a copper-based sintered sliding material.
Inventors:
TAKAYAMA TAKEMORI
ONISHI TETSUO
TANAKA YOSHIKIYO
MAEDA KEIICHI
SATO KANICHI
ONISHI TETSUO
TANAKA YOSHIKIYO
MAEDA KEIICHI
SATO KANICHI
Application Number:
JP2002135275A
Publication Date:
March 28, 2003
Filing Date:
May 10, 2002
Export Citation:
Assignee:
KOMATSU MFG CO LTD
International Classes:
B22F5/00; B22F7/00; B22F7/06; B22F7/08; C22C1/05; C22C9/02; C22C9/06; C22C9/08; C22C32/00; F16C33/04; F16C33/12; F16C33/14; F16C33/24; (IPC1-7): C22C9/02; B22F7/00; B22F7/06; B22F7/08; C22C1/05; F16C33/12; F16C33/14; F16C33/24
Attorney, Agent or Firm:
Tsutomu Inoue
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