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Title:
COPPER-CLAD PLATE
Document Type and Number:
Japanese Patent JP2008290304
Kind Code:
A
Abstract:

To provide a copper-clad plate which has high dimensional stability, a proper modulus of elasticity, and has slidability by generating surface projections by adding fine inorganic particles, uses a polyimide film applicable to an automatic optical inspection system (AOI), and is suitable for a high performance flexible printed circuit board.

In the copper-clad plate, the polyimide film which is produced by using 3,4'-diaminodiphenyl ether and 4,4'-diaminodiphenyl ether, as diamine components, and pyromellitic acid dianhydride, as an acid dianhydride component, and has slidability by generating the surface projections by adding the fine inorganic particles is used, and a copper layer is formed directly on at least one side of the polyimide film without using an adhesive.


Inventors:
SAWAZAKI KOICHI
KOKUNI MASAHIRO
MAEDA SHU
Application Number:
JP2007136707A
Publication Date:
December 04, 2008
Filing Date:
May 23, 2007
Export Citation:
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Assignee:
TORAY DU PONT KK
International Classes:
B32B15/088; C08J5/18; C08K3/00; C08L79/08; H05K1/03
Attorney, Agent or Firm:
Tomonori Iwami



 
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