COPPER FOIL FOR PRINTED WIRING BOARD

Japanese Patent JP3768619

B2

PROBLEM TO BE SOLVED: To achieve etching easily and completely and to prevent copper from remaining and undercut from occurring in several kinds of etching solutions at the time of etching by forming a nickel - cobalt layer containing phosphor at least on one surface of a copper layer.
SOLUTION: A copper foil that becomes the copper layer of a basic layer is used for a normal printed circuit board and includes an electrolytic copper foil and a rolled copper foil or may be obtained by performing roughening treatment and electrolytic deposition roughening treatment onto the surface of the copper layer to improve adhesion property. A nickel - cobalt layer containing phosphor is formed on the surface of the copper layer, for example, by the electroplating method, the electroless plating method, the vacuum deposition method, and the sputtering method. When the electroplating method is used, a phosphor compound is dissolved in the nickel + cobalt alloy plating liquid and a nickel - cobalt layer containing phosphor is formed on the copper layer according to a normal method.

JP2011014633	COPPER FOIL FOR PRINTED WIRING BOARD
JP2023134118	CARBON INK, ELECTRONIC COMPONENT, AND MANUFACTURING METHOD FOR THE SAME
JPS6354472	ELECTRICALLY CONDUCTIVE PASTE

Suzuki Akitoshi
Otsuka Hideo
Sadao Matsumoto

JP28627996A

April 19, 2006

October 29, 1996

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Furukawa Circuit Foil Co., Ltd.

H05K1/09; C25D3/56; H05K3/38; (IPC1-7): H05K1/09; C25D3/56; H05K3/38

JP60086894A
JP6054829B2
JP6120028A
JP63109184A
JP54114436A
JP3119701A

Hajime Tsukuni
Mutsuo Watanabe
Fumio Shinoda

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