Title:
接着剤付き銅箔、銅張積層板および配線基板
Document Type and Number:
Japanese Patent JP7421337
Kind Code:
B2
Abstract:
There are provided a wiring substrate having a low dielectric constant and a low dielectric loss tangent, and an adhesive-attached copper foil and a copper-clad laminate that are suitable for manufacture of the wiring substrate and have improved adhesiveness to a copper foil. An adhesive-attached copper foil includes: a copper foil on one surface; and an adhesive layer provided on one surface of the copper foil, in which this copper foil has a roughened surface that is surface-treated by methacrylic silane, acrylic silane, or isocyanurate silane, and the adhesive layer is formed on the roughened surface and is made of a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.
Inventors:
Ichiro Uchida
Application Number:
JP2019508596A
Publication Date:
January 24, 2024
Filing Date:
January 15, 2018
Export Citation:
Assignee:
Continental Automotive GmbH
International Classes:
H05K3/38; B32B15/08; B32B15/20; C09J11/06; C09J125/10; C09J171/12; H05K1/03
Domestic Patent References:
| JP2016028885A | ||||
| JP2005015613A | ||||
| JP2003138127A |
Foreign References:
| WO2013105650A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office
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