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Title:
COPPER FOIL WITH CARRIER, PROCESS FOR PRODUCING COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, AND PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2014129554
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier where, before a lamination step of laminating a carrier onto an insulation substrate, the adhesion between the carrier and the ultra-thin copper layer is high, while after the lamination step, the adhesiveness is lowered, so that the carrier and the ultra-thin copper layer can be easily separated at an interface therebetween, and further the occurrence of pinholes on the copper-layer-side surface is well suppressed.SOLUTION: In the copper foil with a carrier, an intermediate layer is formed by laminating both nickel and molybdenum or cobalt or a molybdenum-cobalt alloy in this order from the copper foil carrier side. The deposit of nickel is 1000-40000 μg/dmand the deposit of molybdenum is 50-1000 μg/dm, or the deposit of cobalt is 50-1000 μg/dm. In a cross section composed of the copper foil carrier, the intermediate layer and the ultra-thin copper layer, in an area which includes all of these three constituents in this order, the maximum nickel concentration is 50 to 95 mass%, while molybdenum or cobalt is present on the ultra-thin-copper-layer side of the nickel layer, the maximum amount of molybdenum or cobalt being 1 to 50 mass%.

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Inventors:
HONDA MISATO
NAGAURA YUTA
Application Number:
JP2012270749A
Publication Date:
July 10, 2014
Filing Date:
December 11, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D7/06; B32B15/01; C25D5/12; H05K1/09
Domestic Patent References:
JP2007186782A2007-07-26
JP2006022406A2006-01-26
JP2010006071A2010-01-14
JP2007007937A2007-01-18
JP2011129685A2011-06-30
JP2010258398A2010-11-11
JP2012102407A2012-05-31
JP4659140B22011-03-30
Foreign References:
WO2012046804A12012-04-12
Attorney, Agent or Firm:
Axis International Patent Business Corporation



 
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