Title:
COPPER ORGANIC METAL, METHOD FOR PREPARING COPPER ORGANIC METAL AND COPPER PASTE
Document Type and Number:
Japanese Patent JP2013136577
Kind Code:
A
Abstract:
To provide: a copper organic metal that can be subjected to a low temperature sintering process and has an improved conductivity after the sintering process as compared to the related art; a method for preparing the copper organic metal; and a copper paste.
The copper organic metal is constituted by combining a copper atom, [R-CO2] and an amine-based ligand (L).
Inventors:
LEE KWI JONG
KWON JI HAN
KIM DONG HOON
KWON JI HAN
KIM DONG HOON
Application Number:
JP2012282160A
Publication Date:
July 11, 2013
Filing Date:
December 26, 2012
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
C07F1/08; H01B1/22
Domestic Patent References:
| JP2009256218A | 2009-11-05 | |||
| JP2005035984A | 2005-02-10 | |||
| JP2009074054A | 2009-04-09 | |||
| JP2007321215A | 2007-12-13 | |||
| JP2002329419A | 2002-11-15 | |||
| JP2012046779A | 2012-03-08 |
Foreign References:
| WO2010018782A1 | 2010-02-18 | |||
| WO2008013002A1 | 2008-01-31 |
Attorney, Agent or Firm:
Konobu Kato
Takafumi Oshima
Takafumi Oshima