To easily form a homogeneous and dense copper plating film on the surface of a hydrophobic PTFE (polytetrafluoroethylene) substrate for a high frequency circuit.
In a plating method, following processes are successively performed: a process (1) of subjecting a PTFE substrate to a plasma treatment in the presence of helium gas; a process (2) of forming a self-assembled monolayer (SAM) on the surface of the substrate by reacting the substrate with a silane coupling agent; a process (3) of subjecting the substrate having the formed SAM thereon to an activation treatment using a catalyst solution for electroless plating, which is an aqueous solution containing a palladium salt; a process (4) of reducing palladium ions fixed on the substrate into metal palladium; a process (5) of forming an electroless copper plating film on the substrate by treating the resulting substrate with an electroless copper plating solution; and a process (6) of further forming an electrolytic copper plating film on the electroless copper plating film by treating the resulting substrate with an electrolytic copper plating solution.
HONDA KOJI
| JP2007150221A | 2007-06-14 |
| US5945486A | 1999-08-31 |
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