To provide a copper-polyimide laminate and a three-dimensional molding which enable both a thermoplastic polyimide film and copper foil to be three-dimensionally molded without being ruptured, and a method of manufacturing the three-dimensional molding.
A copper-polyimide laminate 10 is formed by bonding rolled copper foil 4 which contains Ag having a mass ratio of 50-300 ppm and oxygen having a mass ratio of 100-300 ppm, and has the rest formed of copper and inevitable impurities, and a thermoplastic polyimide film 8 in which an aromatic tetracarboxylic dianhydride and an aromatic diamine are condensation polymerized, a glass-transition temperature is in a range of ≥260°C and <320°C, and a storage modulus at 25-200°C is in a range of 1×109 to 4×109 Pa by an adhesion layer 6 which is formed of a thermoplastic polyimide having a glass-transition temperature set to be in a range of ≥200°C and <260°C and having a storage modulus at 25-200°C set to be in a range of 1×109 to 4×109 Pa.
KAN KAZUKI
MACHIDA HIDEAKI
KURIHARA HITOSHI
TORAY DU PONT KK
| JP2007005003A | 2007-01-11 | |||
| JP2005340184A | 2005-12-08 | |||
| JP2000212661A | 2000-08-02 | |||
| JP2010100887A | 2010-05-06 | |||
| JP2002240195A | 2002-08-28 | |||
| JP2000103010A | 2000-04-11 | |||
| JP2004261961A | 2004-09-24 | |||
| JP2008144049A | 2008-06-26 | |||
| JP2003151328A | 2003-05-23 |
Akira Shimoda
Kazuhiko Kurihara