Title:
COUPLING DEVICE FOR LAID TATAMI MAT
Document Type and Number:
Japanese Patent JP2012154156
Kind Code:
A
Abstract:
To provide a coupling device for a laid tatami mat which can be easily peeled without leaving marks on a floor surface when being stuck to it and can be adhered again even after being temporarily peeled, by using a self-adhesive member as an antislip adsorbent.
The coupling device for the laid tatami mat fixes a self-adhesive pad to the whole or part of an undersurface of a plate which forms at least two projections thereon to fit into holes formed at the corners of a tatami unit.
Inventors:
GOTO TADASHI
Application Number:
JP2011025420A
Publication Date:
August 16, 2012
Filing Date:
January 21, 2011
Export Citation:
Assignee:
KG PALTEC CO LTD
International Classes:
E04F15/02
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