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Patent Searching and Data


Title:
Coupling method
Document Type and Number:
Japanese Patent JP6220777
Kind Code:
B2
Abstract:
The invention relates to a process for bonding a silicone or silicone based material to a polyurethane and use of the bonded silicone-polyurethane in the manufacture of biomaterials, devices, articles or implants, in particular long term implantable medical devices in the fields of cardiology, orthopedics, plastic surgery and gastroenterology. The process involves the steps of (a) flame treating a surface of the silicone or silicone based material and (b) bonding the polyurethane to the flame treated surface of the silicone or silicone based material.

Inventors:
Padsulgikar, Ajay Di.
Application Number:
JP2014508557A
Publication Date:
October 25, 2017
Filing Date:
April 26, 2012
Export Citation:
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Assignee:
AORTECH INTERNATIONAL PLC
International Classes:
B29C65/00; A61K47/34; A61L17/00; A61L27/34; A61L29/08; A61L31/08; C08G18/61; C08J7/00; C08J7/04
Domestic Patent References:
JP2002511793A
JP2008119675A
JP11144549A
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Atsushi Honda