COUPLING STRUCTURE OF OPTICAL WAVEGUIDE

Title:

COUPLING STRUCTURE OF OPTICAL WAVEGUIDE

Document Type and Number:

Japanese Patent JP3450068

Kind Code:

B2

Abstract:

PURPOSE: To easily form an auxiliary waveguide to be used for execution of distributed coupling without using a fine working means for producing waveguides by forming a groove near an optical waveguide, packing a high- molecular resin into the groove and curing the resin.
CONSTITUTION: The optical waveguide 11 is first formed on a waveguide substrate 16. Next, the groove 14 having an opening is formed by a means, such as mechanical grinding, on a device surface 15 along the optical waveguide 11 from the end face of the optical waveguide on the substrate 16. The high- molecular resin is packed into the groove 14 for the auxiliary waveguide and is cured. The auxiliary waveguide is completed by polishing the waveguide surface 15 and the waveguide end face in such a manner that these surfaces are mated, after the curing. The reason why the high-molecular resin is used as the material for the auxiliary waveguide lies in that the packing and curing are easily executable. While the high-molecular resin is inferior in propagation loss when compared with materials for waveguides, such as quartz glass, its propagation loss occurring in the material is negligible as its waveguide length is small if the high-molecular resin is used only for the auxiliary waveguide.

Inventors:

Akira Kashiwazaki

Application Number:

JP29643794A

Publication Date:

September 22, 2003

Filing Date:

November 30, 1994

Export Citation:

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