Title:
COVER TAPE AND PACKAGE BODY FOR EMBOSSED CARRIER
Document Type and Number:
Japanese Patent JP2002160763
Kind Code:
A
Abstract:
To provide a cover tape for an embossed carrier and a package body therewith which can be used without being affected by materials of the embossed carrier in housing electronic components, and also which can stabilize the quality of the components and improve operating efficiency in taking out the components by a fitting machine.
On one side surface of a substrate film 2 an antistatic resin layer 1 is laminated, and on the other side surface a conductive layer 3 and an adhesive material layer 4 are successively laminated.
Inventors:
YAMAMOTO WATARU
KURODA KENJIRO
OYA MASAHITO
KURODA KENJIRO
OYA MASAHITO
Application Number:
JP2000357195A
Publication Date:
June 04, 2002
Filing Date:
November 24, 2000
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B65D73/02; B65D85/86; (IPC1-7): B65D73/02; B65D85/86
Previous Patent: PACKAGED MAKIZUSHI (ROLLED SUSHI) AND ITS PACKAGING SHEET
Next Patent: FOOD PRESERVATION CONTAINER
Next Patent: FOOD PRESERVATION CONTAINER