PURPOSE: To prevent the change in the compsn. of the cream solder by using cream solder contg. a tacky adhesive agent component which develops tackiness when irradiated with UV rays, solder particles, solvent and flux.

CONSTITUTION: The tacky adhesive agent component contained in the cream solder 3 forms a tacky film 5 on the surface of the cream solder 3 when the component is irradiated with the UV rays. The sepn. of the outdoor air from the inside of the cream solder 3 is executed by the film 5, by which the evaporation of the components in the cream solder 3 is prevented. Chip type electronic parts 4 are mounted on the tacky film 5, then the deviation of the chip type electronic parts 4 by the vibration during packaging of the electronic parts 4 onto a printed wiring board 1 and during transportation thereof is prevented by the tacky adhesive strength thereof.