Title:
CREATION METHOD AND CREATION DEVICE OF SIMPLE HEAT SIMULATION MODEL OF MULTILAYER SUBSTRATE, AND SIMPLE MODEL CREATION PROGRAM
Document Type and Number:
Japanese Patent JP2023082383
Kind Code:
A
Abstract:
To provide a simple model which can highly accurately simulate the influence of substrate heat release in comparison to a conventional simple model using the average equivalent thermal conductivity.SOLUTION: There is provided a simple heat simulation model corresponding to a virtual two-layer substrate having two wiring layers P11, P12 at positions satisfying a prescribed condition with respect to a thermal gravity center position HG by calculating the thermal gravity center position HG of a multilayer substrate. Here, the prescribed condition comprises: the first condition in which the thermal inertial moment of the multilayer substrate is equal to the thermal inertial moment of the virtual two-layer substrate replacing the multilayer substrate; and the second condition in which the thermal conductance of the multilayer substrate is equal to the thermal conductance of the virtual two-layer substrate. Consequently, the substrate heat release characteristics in a case where a heat generating component is placed on a substrate surface of a simple model can be simulated in consideration of a distance to the first wiring layer P11 from the substrate surface.SELECTED DRAWING: Figure 5
Inventors:
ARIGA YOSHIAKI
Application Number:
JP2021196117A
Publication Date:
June 14, 2023
Filing Date:
December 02, 2021
Export Citation:
Assignee:
KOA CORP
International Classes:
G06F30/20; H05K3/00
Attorney, Agent or Firm:
Kazuyuki Tachibana