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Title:
CROSSLINKED CURING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2004085781
Kind Code:
A
Abstract:

To provide a crosslinked curing resin composition which is a liquid with low viscosity so that an uncured part of the crosslinked curing resin composition can be easily removed in a cleaning process and from which a dry film resist having sufficient coating film strength and having high glass transition temperature is formed in a cured part of the composition cured by active energy rays.

The crosslinked curing resin composition comprises: (A) a component containing at least one kind of unsaturated carboxylic acid and methacrylate which may contain styrene (a thermoplastic resin for a binder); (B) polyfunctional (meth)acrylate (crossliking agent) containing di(meth)acrylate having an alicyclic framework; and (C) a photopolymerization initiator. The di(meth)acrylate having an alicyclic framework in the component (B) is expressed by general formula (1), wherein R1 represents a hydrogen atom or a methyl group, R2 represents an alkylene group, and each of a and b independently represents an integer from 0 to 5.


Inventors:
SANAI YASUYUKI
Application Number:
JP2002245074A
Publication Date:
March 18, 2004
Filing Date:
August 26, 2002
Export Citation:
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Assignee:
TOAGOSEI CO LTD
International Classes:
G03F7/033; C08F2/44; C08F265/06; C08F290/06; C08L33/00; C08L71/00; C08L71/02; G03F7/004; G03F7/027; (IPC1-7): G03F7/033; C08F2/44; C08F265/06; C08F290/06; C08L33/00; C08L71/00; C08L71/02; G03F7/004; G03F7/027