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Title:
CU ALLOY FOR LEAD WIRE MATERIAL OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS58147142
Kind Code:
A
Abstract:

PURPOSE: To produce Cu alloy provided with excellent bending workability, conductivity, strength and heat resistance by a method wherein one or two or more kinds of specified amount of rare earth elements, Cr, Zr and O2 are added to Cu.

CONSTITUTION: The Cu alloy for lead wire material contains 0.05W0.5wt% Sn, total percentage of 0.01W0.3wt% comprising Cr, Zn, one or two or more kinds of rare earth elements and 0.0010wt% or less O2 as well as residual Cu and indispensable impurities. Sn content is limited 0.05W0.5% because if it does not exceed 0.05%, strength and heat resistance are hardly improved while if it exceeds 0.5%, electric (heat) conductivity will be remarkably deteriorated. Likewise the total percentage of said rare earth element is limited from 0.01 to 0.3% because if it does not exceed the lower limit, sufficient strength and heat resistance are not provided while if it exceeds the upper limit, electric (heat) conductivity will be remarkably deteriorated. The Cu alloy with said composition may be provided with excellent properties such as tensile strength of 38W44kg/mm2, halfsoftening temperature of 350W410°C, conductivity of 67W 94% IACS and bending workability.


Inventors:
YAMATO KOUZOU
AKASAKA KIICHI
SHINOZAKI SHIGEO
KUROYANAGI TAKU
Application Number:
JP3015882A
Publication Date:
September 01, 1983
Filing Date:
February 26, 1982
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C22C9/00; H01L23/48; H01L23/49; (IPC1-7): C22C9/04; H01L23/48
Domestic Patent References:
JPS5347287A1978-04-27
JPS5531173A1980-03-05
JPS52123923A1977-10-18
JPS5479120A1979-06-23
JPS5479121A1979-06-23
JPS5424811A1979-02-24
Attorney, Agent or Firm:
Kiyoshi Minoura



 
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