Title:
デバイス用硬化性接着シート
Document Type and Number:
Japanese Patent JP6967171
Kind Code:
B2
Abstract:
A curable adhesive sheet for a device, having an adhesive layer containing component (A) and component (B). The curable adhesive sheet for a device has an adhesive sheet provides a cured material having excellent low-dielectric characteristics in a high-frequency region. Component (A): a polyphenylene ether resin having a vinyl group. Component (B): A compound having two or more hydrocarbon groups that have a double bond at the terminal end thereof.
Inventors:
Kenta Nishijima
Application Number:
JP2021087733A
Publication Date:
November 17, 2021
Filing Date:
May 25, 2021
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J7/30; C09J4/00; C09J11/06; C09J123/00; C09J171/12
Domestic Patent References:
| JP2020002217A | ||||
| JP5309785A | ||||
| JP11087927A | ||||
| JP2001342450A | ||||
| JP2019023263A | ||||
| JP2017014475A | ||||
| JP2015086330A | ||||
| JP2020172588A |
Foreign References:
| WO2016147984A1 | ||||
| WO2018179682A1 |
Attorney, Agent or Firm:
Haruhito Oishi
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