To provide a curable composition and a contact type adhesive.

The curable composition comprises a polymer (P) obtained by introducing a trialkoxysilyl group to a polymer (V) obtained by reacting an alkenyl halide with a polymer (H) obtained by subjecting an alkylene oxide to ring-opening polymerization on a compound having two active hydrogen atoms, having a polyoxyalkylene chain and the trialkoxysilane group at the molecular terminal, and also having ≥15,000 number average molecular weight, and a polymer (Q) having a (meth)acrylate monomer unit and a hydrolyzable silyl group. The contact type adhesive comprises the curable composition.

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