Title:
CURABLE COMPOSITION, CURED PRODUCT, ADHESIVE AND SEALING MATERIAL
Document Type and Number:
Japanese Patent JP2023009597
Kind Code:
A
Abstract:
To provide a curable composition having low viscosity and good strength and stretchability which can afford a cured product having a high modulus.SOLUTION: There is provided a curable composition which comprises a polymer A and a polymer B, wherein the ratio of the mass of the polymer A to the mass of the polymer B is 5/95 to 95/5. Polymer A: an oxyalkylene polymer having 2 to 8 terminal groups on average per molecule, 0.3 to 1.0 of reactive silicon group represented by -SiXaR3-a on average per one terminal group and a hydroxyl group equivalent molecular weight of 500 to 2000 per one terminal group. Polymer B: an oxyalkylene polymer having more than 1.0 of the reactive silicon groups on average per one terminal group. R represents a monovalent organic group having 1 to 20 carbon atoms other than a hydrolyzable group and X represents a hydrogen atom, a halogen atom, a hydroxyl group or a hydrolyzable group. a is an integer of 1 to 3. When a is 2 or more, X may be the same or different, and when a is 1, R may be the same or different.SELECTED DRAWING: None
Inventors:
JIMBO YUSUKE
KONNO KAZUMASA
SUNAYAMA YOSHITAKA
ITO TAKASHI
KAKU DAISUKE
KONNO KAZUMASA
SUNAYAMA YOSHITAKA
ITO TAKASHI
KAKU DAISUKE
Application Number:
JP2021113010A
Publication Date:
January 20, 2023
Filing Date:
July 07, 2021
Export Citation:
Assignee:
AGC INC
International Classes:
C08L71/00; C09J171/02; C09K3/10
Attorney, Agent or Firm:
Patent Attorney Shiga International Patent Office