Title:
硬化性組成物、硬化物、（メタ）アクリル樹脂、及び化合物
Document Type and Number:
Japanese Patent JP7376346
Kind Code:
B2
Abstract:
To provide a curable composition that gives a cured product having low relative dielectric constants, a cured product of the composition, a method for producing a patterned cured film using a specific photosensitive composition as the curable composition, a (meth)acrylic resin suitably used as a component of the curable composition, a compound having a specific structure and suitably used as a component of the curable composition or a raw material for the (meth)acrylic resin, and a method for producing the compound.SOLUTION: An alicyclic epoxy compound of a specific structure having a (meth)acryloyl group and/or a (meth)acrylic resin having a constitutional unit derived from the alicyclic epoxy compound is used as a curable component of the curable composition.SELECTED DRAWING: None
Inventors:
Butterfly Ensei
Dai Shioda
Naohiko Ikuma
Dai Shioda
Naohiko Ikuma
Application Number:
JP2019234678A
Publication Date:
November 08, 2023
Filing Date:
December 25, 2019
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
C08G59/30; C07F7/18; C08F30/08; C08G59/68; G03F7/075
Domestic Patent References:
| JP2014220225A | ||||
| JP2007079481A | ||||
| JP2009294619A | ||||
| JP2003176281A | ||||
| JP2000143588A | ||||
| JP2020002215A |
Foreign References:
| KR1020060024223A | ||||
| WO2018123994A1 | ||||
| WO2020004408A1 |
Attorney, Agent or Firm:
Masayuki Shobayashi
Kazuyoshi Hayashi
Kazuyoshi Hayashi
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