Title:
硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、プリント回路基板、フレキシルブル配線基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、成形品
Document Type and Number:
Japanese Patent JP6492455
Kind Code:
B2
Inventors:
Junji Yamaguchi
Kazuo Arita
Tatsuya Okamoto
Takayuki Kanematsu
Kazuo Arita
Tatsuya Okamoto
Takayuki Kanematsu
Application Number:
JP2014166613A
Publication Date:
April 03, 2019
Filing Date:
August 19, 2014
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08G73/06; C08G59/18; C08J5/24; C08K3/00; C08K5/29; H05K1/03
Domestic Patent References:
| JP2008088079A | ||||
| JP2006124494A | ||||
| JP2006022309A | ||||
| JP63150257A | ||||
| JP2013091781A | ||||
| JP2000313737A |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Makoto Negishi
Akihiro Iwamoto
Takayuki Ohno
Makoto Negishi