Title:
硬化性組成物、その硬化物、及び半導体装置
Document Type and Number:
Japanese Patent JP7436175
Kind Code:
B2
Abstract:
An object of the present invention is to provide a curable composition which gives a cured product having high hardness and toughness and excellent light transmission in a short-wavelength region. The curable composition contains the following (A), (B) and (C): (A) an addition reaction product of an organosilicon compound represented by formula (1) and an organic compound having two or more alkenyl groups in one molecule and not containing a silicon atom, the addition reaction product having two or more SiH groups in one molecule (In the formula, R^1 represents a substituted or unsubstituted divalent hydrocarbon group having 1-12 carbon atoms.); (B) a compound having two or more alkenyl groups in one molecule; and (C) a hydrosilylation reaction catalyst.
Inventors:
Daisuke Hirano
Shigeki Yasuda
Shigeki Yasuda
Application Number:
JP2019185531A
Publication Date:
February 21, 2024
Filing Date:
October 08, 2019
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08G77/52; C08L83/16; C08G77/60; C08L83/07; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| JP2009173910A | ||||
| JP2019131806A | ||||
| JP7149907A | ||||
| JP2008505942A | ||||
| JP2015147879A | ||||
| JP2002251918A | ||||
| JP2002332417A | ||||
| JP2003055557A | ||||
| JP2012201754A | ||||
| JP2020026502A | ||||
| JP2021059682A | ||||
| JP2021059685A |
Foreign References:
| CN109651419A | ||||
| CN109651420A | ||||
| CN109836445A |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toru Otsuka
Toshihiro Kobayashi
Toru Otsuka
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