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Patent Searching and Data


Title:
CURABLE COMPOSITION HAVING MOLD RELEASABILITY
Document Type and Number:
Japanese Patent JP2004059783
Kind Code:
A
Abstract:

To provide a curable composition for molding, comprising a vinylic polymer having excellent oil resistance, heat resistance, weather resistance or the like, curable by a hydrosilylation reaction, and having improved mold releasability.

The curable composition consists essentially of (A) a vinylic polymer (I) having at least one alkenyl group reactable by hydrosilylation in the molecule, (B) a hydrosilyl group-containing compound (II), (C) a hydrosilylation catalyst and (D) a metallic soap.


Inventors:
KOTANI JUN
NAKAGAWA YOSHIKI
Application Number:
JP2002221373A
Publication Date:
February 26, 2004
Filing Date:
July 30, 2002
Export Citation:
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Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C08L57/00; C08F8/42; C08K5/098; C08K5/54; C08L83/04; (IPC1-7): C08L57/00; C08L83/04