To provide a novel silicon-containing curable composition applicable as a heat-resistant structural material, and a manufacturing method of a molded body using the same.
The curable composition comprises (A) a silsesquioxane oligomer obtainable by co-hydrolysis of CH2=CH-C6H4-SiX3 (wherein X is a hydrolyzable group) and RSiX'3 (wherein R is a monovalent organic group other than a styryl group; and X' is a hydrolyzable group), (B) a silicon compound bearing at least two SiH groups in the molecule and (C) a hydrosilylation catalyst. The manufacturing method of a molded body comprises keeping the curable composition containing an organic solvent in an amount of 20-200 pts.wt. based on 100 wts.wt. of (A) at a temperature lower than the boiling point of the organic solvent contained therein and subsequently raising the temperature thereof stepwise or contintinuously within the range of 20-400°C to cause cure.
TSUMURA MANABU
IWAHARA TAKANAO
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