硬化性組成物、硬化物の製造方法、およびその硬化物

Japanese Patent JP7216470

B2

Provided are a curable composition that provides a cured product with a high glass transition temperature and excellent adhesion, a cured product production method, and a cured product therefrom.　The curable composition includes 45–90 parts by mass of a cationically polymerizable component (A), 0.001–15 parts by mass of a cationic polymerization initiator (B), 1–15 parts by mass of a radically polymerizable component (C), 1–10 parts by mass of a radical polymerization initiator (D), and 1–20 parts by mass of a polymer (E) that is a polymer obtained from the monomer represented by formula (I) (in the formula, X is a C1–7 alkyl group, or the like) or a polymer obtained from the monomer represented by formula (II) (in the formula, R1 represents a hydrogen atom, or the like, and X' is a C1–7 alkyl group, or the like), the components being included in a manner such that the total of component (A) and component (C) is 100 parts by mass. Component (A) includes, as essential components, a glycidylated product (A1) of a polyhydric alcohol, and an oxetane compound (A2). Component (C) includes, as an essential component, a compound (C1) which has an epoxy group and an ethylenically unsaturated group.

JP2017075324	CURABLE COMPOSITION, MANUFACTURING METHOD OF CURABLE COMPOSITION AND SEMICONDUCTOR DEVICE
JP6796247	Epoxy resin composition

Kazuhiko Matsudo
Satoshi Watanabe

JP2016069795A

February 01, 2023

March 30, 2016

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ADEKA CORPORATION

C08L63/00; C08F2/44; C08F2/48; C08F255/00; C08F257/00; C08F261/06; C08F265/04; C08G59/22; C08G59/32; C08G65/18; C08K5/00; C08K5/06; C08K5/103; C08L23/00; C08L25/00; C08L29/00; C08L33/00; C08L71/02

JP2015143352A
JP2010209126A
JP201540283A

Honda Ichiro
Takumi Watanabe

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