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Patent Searching and Data


Title:
CURABLE COMPOSITION, SEALING MATERIAL AND ADHESIVE
Document Type and Number:
Japanese Patent JP2005290275
Kind Code:
A
Abstract:

To provide a moisture-curing type curable composition which is quickly cured with moisture to give a cured product having elasticity and excellent transparency, and can be produced at a low cost.

This curable composition comprises a curable composition comprising a vinylic polymer having cross-linkable silyl groups represented by formula (1): -[Si(R1)2-b(Y)bO]m-Si(R2)3-a(Y)a [R1 and R2 are each a 1 to 20C alkyl, a 6 to 20C aryl, a 7 to 20C aralkyl, or the like; Y is OH or a hydrolyzable group; (a) is 0, 1, 2, to 3; (b) is 0, 1 or 2; (m) is an integer of 0 to 19, where (a)+(m)(b)≥1], at the terminals, and a filler having a refractive index difference of ≤0.02 between the refractive index of the curable composition and that of the filler, and gives a 1 mm-thick cured coating film having a haze value of ≤10.


Inventors:
FUKUI KOJI
SHIMOMURA YORIKO
Application Number:
JP2004109526A
Publication Date:
October 20, 2005
Filing Date:
April 01, 2004
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C09K3/10; C08K3/34; C08L57/06; C08L71/02; C09J151/08; C09J181/00; C09J201/10; (IPC1-7): C08L57/06; C08K3/34; C08L71/02; C09J151/08; C09J181/00; C09J201/10; C09K3/10