Title:
CURABLE COMPOSITION, STRETCHABLE RESIN LAYER, AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
Document Type and Number:
Japanese Patent JP2019123786
Kind Code:
A
Abstract:
To provide a curable composition capable of forming a stretchable resin layer having sufficient stretchability, high adhesion and a high softening point, a stretchable resin layer, and a semiconductor device including the stretchable resin layer.SOLUTION: The curable composition for forming a stretchable resin layer according to the present invention contains (A) an elastomer having a polystyrene chain and a polydiene chain, (B) a monofunctional linear alkyl (meth)acrylate, (C) a monofunctional (meth)acrylate having an alicyclic group, (D) a bi- or higher functional compound having two or more ethylenically unsaturated groups, and (E) a polymerization initiator.SELECTED DRAWING: Figure 1
Inventors:
OTAKE SHUNSUKE
UEHARA SATOSHI
IKEDA AYA
SHIBATA TOMOAKI
TENDO KAZUYOSHI
MINEGISHI TOMONORI
UEHARA SATOSHI
IKEDA AYA
SHIBATA TOMOAKI
TENDO KAZUYOSHI
MINEGISHI TOMONORI
Application Number:
JP2018004198A
Publication Date:
July 25, 2019
Filing Date:
January 15, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F287/00; B32B27/30; C08F2/44; H01L23/29; H01L23/31