Title:
CURABLE COMPOSITION, URETHANE RESIN COMPOSITION, HEAT DISSIPATION MATERIAL, AND ARTICLE
Document Type and Number:
Japanese Patent JP2023047595
Kind Code:
A
Abstract:
To provide a thermally conductive urethane resin composition which has excellent adhesion to a substrate and is free from deterioration in adhesion with time.SOLUTION: A curable composition is used, which contains a polyol (A), a polyisocyanate (B), a phosphate ester (C1) represented by the following general formula (1), an inorganic filler (E), and a plasticizer (F) and which satisfies the following (1)-(5): (1) the polyol (A) contains a hydrogenated polybutadiene polyol; (2) the hydrogenated polybutadiene polyol is contained in an amount of 2-7 wt.% based on the total weight of the curable composition; (3) the inorganic filler (E) is contained in an amount of 83-93 wt.% based on the total weight of the curable composition; (4) the phosphate ester (C1) is contained in an amount of 0.1-3 wt.% based on the total weight of the inorganic filler (E); and (5) the plasticizer (F) is contained in an amount of 1-5 wt.% based on the total weight of the curable composition.SELECTED DRAWING: None
Inventors:
IKEDA SHUNSUKE
NOSE KENTA
NOSE KENTA
Application Number:
JP2021156584A
Publication Date:
April 06, 2023
Filing Date:
September 27, 2021
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08G18/08; C08G18/69; C08K3/013; C08K5/521; C08L75/04