Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JP2002080561
Kind Code:
A
Abstract:
To obtain a curable composition highly adhesive to various base materials.
This curable composition is characterized by comprising (A) a saturated hydrocarbon-based polymer having hydroxy or hydrolyzable group bound to a silicon atom and also having at least one silicon-containing group crosslinkable by forming a siloxane linkage and (B) a nonaromatic epoxy resin having ≥1.5 epoxy functional groups on average in one molecule.
Inventors:
OKAMOTO TOSHIHIKO
TAKASE JUNJI
TAKASE JUNJI
Application Number:
JP2000274824A
Publication Date:
March 19, 2002
Filing Date:
September 11, 2000
Export Citation:
Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C09K3/10; C08G59/40; C08L23/26; C08L63/00; C09J123/22; C09J143/04; C09J163/00; C09J163/08; C09J183/04; H01L31/04; (IPC1-7): C08G59/40; C08L23/26; C08L63/00; C09J123/22; C09J143/04; C09J163/00; C09J163/08; C09J183/04; C09K3/10; H01L31/04