To provide a curable composition coatable by using no solvent or little solvent, providing a cured product having excellent high-temperature creeping property and high-temperature adhesiveness, and hardly leaving paste on an adherend when being peeled off from the adherend to heighten the recyclability.

The curable composition contains (A) 100 pts.wt. of an oxyalkylene-based polymer having a reactive silicon group, (B) 5-150 pts.wt. of a chelate compound comprising an alkylphenol resin, and a metal oxide and/or a metal hydroxide, and (C) 0.1-10 pts.wt. curing catalyst in the composition.