Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JP2018123187
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a curable composition which materializes suppression of foaming of a molded body or a coated film when cured, and is excellent in scratch resistance after being cured.SOLUTION: The curable composition contains: an epoxy resin (X) satisfying the following requirement (x-1); an epoxy resin curing agent (Y) satisfying the requirement (y-1); and an α-olefin (co)polymer (Z) satisfying the following requirements (z-1) and (z-2). (x-1) including at least one selected from among a phenol novolak type, a bisphenol type, a dimer acid type, a rubber-modified type, an alkyl phenol type, an alcohol-modified type, a resorcinol type, a polyglycol type or an ester type. (y-1) including at least one selected from among an amine-based curing agent, a phenol-based curing agent, a mercaptan-based curing agent, an acid anhydride-based curing agent, and a latent curing agent. (z-1) a methyl group index measured fromH-NMR is 25-60% (here, methyl group index means a ratio of an integral value of a peak in a range of 0.50-1.15 ppm to an integral value of a peak in the range of 0.50-2.20 ppm when the α-olefin (co)polymer is dissolved in heavy chloroform andH-NMR is measured, and a solvent peak based on CHClin the heavy chloroform is defined as a reference (7.24 ppm). (z-2) a weight average molecular weight (Mx) determined by gel permeation chromatography (GPC) is 1,500-11,000.SELECTED DRAWING: None
Inventors:
TAKESHIMA ATSUSHI
ABE SHOTA
KAMIYA KIMI
ABE SHOTA
KAMIYA KIMI
Application Number:
JP2017014054A
Publication Date:
August 09, 2018
Filing Date:
January 30, 2017
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L63/00; C08L23/00; C09D7/40; C09D123/00; C09D163/00
Domestic Patent References:
| JP2016041793A | 2016-03-31 |
Foreign References:
| WO2015025918A1 | 2015-02-26 |
Attorney, Agent or Firm:
Patent corporation ssinpat