Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JP2022075060
Kind Code:
A
Abstract:
To provide a curable composition excellent in adhesive force, flexibility, and weather resistance.SOLUTION: The curable composition contains (A) a (meth)acrylate copolymer having 0-1.2 crosslinkable silyl groups per molecule, (B) a polyoxyalkylene polymer having a crosslinkable silyl group, and (C) an epoxy resin having a bisphenol skeleton. The curable composition contains 20-80 pts.mass of the component (A), 10-75 pts.mass of the component (B), and 5-65 pts.mass of the component (C) (provided that the total of the component (A), the component (B), and the component (C) is 100 pts.mass). The weight average molecular weight (Mw) of the component (A) is preferably 1,000 or more and 50,000 or less. The viscosity of the component (A) at 25°C is preferably 1,000 mPa s or more and 300,000 mPa s or less.SELECTED DRAWING: None
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Inventors:
MOCHIZUKI KATSUNOBU
Application Number:
JP2020185601A
Publication Date:
May 18, 2022
Filing Date:
November 06, 2020
Export Citation:
Assignee:
TOAGOSEI CO LTD
International Classes:
C08L33/04; C08L63/02; C08L71/02; C09J133/04; C09J163/02; C09J171/02
Attorney, Agent or Firm:
Ide Masatake
Previous Patent: JPWO2022075059
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