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Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JP3676440
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a curable composition which can cure in the presence of moisture to given a product reduced in surface tackiness (stickiness) by mixing an oxyalkylene polymer having reactive silicon groups with a specified compound.
SOLUTION: This curable composition comprises an oxyalkylene polymer having at least one reactive silicon group and a hydrocarbon compound. The reactive silicon group of the oxalkylene polymer is exemplified by a group represented by the formula: -[Si(R22-a)(Xa) -O-]mSi(R33-b)-Xb [wherein R2 and R3 are each a 1-20C alkyl, a 6-20C aryl, a 7-20C aralkyl, (R4)3SiO- (wherein R4 is a 1-20C hydrocarbon group); X is a hydrolyzalble group or hydroxyl; (a) is 0-2; (b) is 0-3; (m) is 0-19; and (a+Σb)≥1]. The hydrocarbon compound is particularly desirably an aliphatic hydrocarbon. The amount of the hydrocarbon compound used is desirably 0.1-150 pts.wt. per 100 pts.wt. oxyalkylene polymer.


Inventors:
Keiko Nishimura
Masaaki Higashi
Kazumasa Hashimoto
Fumio Kawakubo
Application Number:
JP20446795A
Publication Date:
July 27, 2005
Filing Date:
August 10, 1995
Export Citation:
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Assignee:
Kaneka Corporation
International Classes:
C08K5/01; C08L43/00; C08L43/04; C08L71/00; C08L71/02; (IPC1-7): C08L71/02; C08K5/01; C08L43/04
Domestic Patent References:
JP3181565A
JP7286162A
JP60067573A
JP3181565A
JP7286162A
Attorney, Agent or Firm:
Takehiko Suzue