Title:
硬化性組成物
Document Type and Number:
Japanese Patent JP5080006
Kind Code:
B2
Abstract:
An object of the present invention is to provide a curing composition which is practically curable and highly adhesive even though a non-organotin compound is included as a curing catalyst. Problems involved are solved by a curing composition characterized by including (A) an organic polymer having one or more silicon-containing groups capable of cross linking by forming siloxane bonds, (B) a metal carboxylate and/or carboxylic acid, and (C) a silicon compound having a hetero atom on the carbon atom in the ± or ² position with respect to the silicon atom.
Inventors:
Katsuyuki Wakabayashi
Toshihiko Okamoto
Hiroshi Ando
Toshihiko Okamoto
Hiroshi Ando
Application Number:
JP2005505977A
Publication Date:
November 21, 2012
Filing Date:
April 23, 2004
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08L71/02; C08K5/09; C08K5/17; C08K5/54; C08L23/00; C08L33/06; C08L101/10; C08L43/04
Domestic Patent References:
| JPH02289642A | 1990-11-29 | |||
| JPH03197548A | 1991-08-28 | |||
| JPH03122163A | 1991-05-24 | |||
| JPS6213452A | 1987-01-22 | |||
| JPH04292616A | 1992-10-16 | |||
| JP2000119488A | 2000-04-25 | |||
| JPH09141193A | 1997-06-03 | |||
| JPH06157754A | 1994-06-07 | |||
| JPH04202481A | 1992-07-23 | |||
| JPH0324165A | 1991-02-01 | |||
| JP2001342363A | 2001-12-14 | |||
| JPH09183902A | 1997-07-15 |
Foreign References:
| WO2003014226A1 | 2003-02-20 |
Attorney, Agent or Firm:
Atomi International Patent Office