Title:
硬化性組成物
Document Type and Number:
Japanese Patent JP6740226
Kind Code:
B2
Abstract:
Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.
Inventors:
Naoko Tsuji
Hiromi Tanaka
Akira Yamakawa
Akihiro Shibamoto
Nobuhiko Harada
Hiromi Tanaka
Akira Yamakawa
Akihiro Shibamoto
Nobuhiko Harada
Application Number:
JP2017525149A
Publication Date:
August 12, 2020
Filing Date:
June 07, 2016
Export Citation:
Assignee:
Daicel Corporation
International Classes:
B32B27/00; C08G59/32; B32B27/38; C08G77/18; C08L83/06; C09J7/20; C09J7/30; C09J7/35; C09J11/06; C09J183/06
Domestic Patent References:
| JP2008248236A | ||||
| JP2004346144A | ||||
| JP2014169433A | ||||
| JP2012116989A | ||||
| JP2012062457A | ||||
| JP4275337A | ||||
| JP2014177632A | ||||
| JP2010280885A |
Foreign References:
| WO2004072150A1 | ||||
| US20130331476 | ||||
| US20150159044 | ||||
| WO2014204010A1 |
Attorney, Agent or Firm:
Goto Patent Office