Title:
硬化性組成物
Document Type and Number:
Japanese Patent JP7246313
Kind Code:
B2
Abstract:
Provided are: a curable composition of which a cured product after being cured has high strength, high rigidity and flexibility; and a cured product obtained by curing said composition. The present invention provides a multi-pack type curable composition containing: an agent A containing polyoxyalkylene (A) having more than one reactive silicon group at one terminal, a reactive-silicon-group-containing (meth)acrylic ester polymer (B), and an epoxy resin curing agent (D) having a tertiary amine; and an agent B containing an epoxy resin (C) and a silanol condensation catalyst, wherein the weight ratio between the polyoxyalkylene (A) and the (meth)acrylic ester polymer (B) is 95:5 to 50:50, and wherein the weight ratio between the total amount of (A) and (B) and the epoxy resin (C) is 90:10 to 50:50.
Inventors:
Kiyoshi Miyafuji
Application Number:
JP2019546702A
Publication Date:
March 27, 2023
Filing Date:
October 01, 2018
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08L71/02; C08G59/50; C08L33/06; C08L43/04; C08L63/00; C09J133/06; C09J143/04; C09J163/00; C09J171/02
Domestic Patent References:
| JP2015105324A | ||||
| JP2017019908A |
Foreign References:
| WO2016002907A1 | ||||
| WO2017057719A1 | ||||
| WO2013180203A1 |
Attorney, Agent or Firm:
Ariko Patent Office