Title:
硬化性組成物
Document Type and Number:
Japanese Patent JP7261787
Kind Code:
B2
Abstract:
Provided is a curable composition in which a cured product after curing has high strength, high rigidity, and flexibility, and a cured product obtained by curing the curable composition. A multi-pack curable composition including an A agent containing a polyoxyalkylene polymer (A) having a trifunctional reactive silicon group, a (meth)acrylate ester polymer (B) having a trifunctional reactive silicon group, and an epoxy resin curing agent (D) having a tertiary amine, and a B agent containing an epoxy resin (C) and a silanol condensation catalyst (E), in which a weight ratio of (A):(B) is 95:5 to 50:50, a weight ratio of a total of (A) and (B):(C) is 90:10 to 50:50, and (B) contains a polymer containing 40% by weight or more of alkyl (meth)acrylate having 1 to 3 alkyl carbon atoms in a total monomer.
Inventors:
Kiyoshi Miyafuji
Application Number:
JP2020500981A
Publication Date:
April 20, 2023
Filing Date:
February 20, 2019
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08G59/50; C08F220/12; C08F230/08; C08G65/336; C09J11/04; C09J11/06; C09J133/06; C09J143/04; C09J163/00; C09J171/02
Domestic Patent References:
JP2016216633A | ||||
JP2015172119A | ||||
JP2017019908A | ||||
JP2014114434A | ||||
JP2015105324A | ||||
JP2014111783A | ||||
JP2007023255A |
Foreign References:
WO2013180203A1 | ||||
WO2016002907A1 | ||||
WO2017057719A1 |
Attorney, Agent or Firm:
Ariko Patent Office
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