PURPOSE: To obtain a curable compsn. which contains a specific polyene, a specific silicon compd., and an epoxy-functional compd., is excellent in mechanical and adhesive properties, and is useful for composite materials, printed circuit boards, etc.
CONSTITUTION: This compsn. contains a polyene (A) (e.g. dicyclopentadiene) having at least two hydrosilylation-reactive carbon-carbon double bonds, a silicon compd. (B) (e.g. methylhydrocyclosiloxane) which has at least two hydrosilylation-reactive SiH groups and comprises at least one compd. selected from among cyclic polysiloxanes, tetrahedral siloxysilanes, and linear polysiloxanes, and a compd. (C) (e.g. epoxyoctene) having at least one epoxy- functional group, provided at least either of the polyene or the silicon compd. has at least two hydrosilylation-reactive sites.
RICHIYAADO RII BURADEI
REIMONDO TEII REIBUFURIIDO SHI
DEKAI RUU
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