CURABLE MOLDING MATERIAL AND PREPARATION THEREOF

Title:

CURABLE MOLDING MATERIAL AND PREPARATION THEREOF

Document Type and Number:

Japanese Patent JPH0673279

Kind Code:

A

Abstract:

PURPOSE: To provide a technically easy process capable of practicing in a short cycle time which produces a dispersion of finely divided ethylene polymer in an unsaturated polyester which provides a molding cured by adding a peroxide with a high stiffness and a low shrinkage factor.

CONSTITUTION: The process which produces the curable molding material based on a dispersion of 10-50 wt.% of finely divided ethylene polymer in 90-50 wt.% of an unsaturated polyester resin comprises distributing uniformly a melt of ethylene polymer in a melt of an unsaturated polyester.

More Like This:

JP2011017015	AQUEOUS NON-IONICALLY STABILIZED EPOXY RESIN
JP2016029125	TWO-PACK CURABLE RESIN COMPOSITION, COVERING MATERIAL, COVERING METHOD AND COVERING STRUCTURE
WO/2017/159756	COATING COMPOSITION, METHOD FOR FORMING COATING FILM, PROCESS FOR PRODUCING ARTICLE, AND ARTICLE

Inventors:

ANTON HETSUSE
YURUGEN HOFUMAN
BUARUTAA HETSUKUMAN
FUORUKAA BUARUTSUERAN

Application Number:

JP10394093A

Publication Date:

March 15, 1994

Filing Date:

April 30, 1993

Export Citation:

Click for automatic bibliography generation Help

Assignee:

BASF AG

International Classes:

C08L63/10; C08L67/06; C08L75/14; C08L75/16; (IPC1-7): C08L67/06

Attorney, Agent or Firm:

Tajiro Taiji

Next Patent: POLYCARBONATE RESIN COMPOSITION IMPROVED IN MELT FLOW CHARACTERISTIC