Title:
硬化性オルガノポリシロキサン組成物
Document Type and Number:
Japanese Patent JP4733933
Kind Code:
B2
Abstract:
A curable organopolysiloxane composition comprising: (A) an organopolysiloxane having an average of at least 1.5 alkenyl groups per molecule; (B) an organopolysiloxane having an average of at least 1.5 silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; and (D) microscopic particles of thermoplastic resin, said particles comprising a thermoplastic resin and at least one type of an organometallic compound selected from the group consisting of organotitanium compound, organozirconium compound, organoaluminum compound, and organotin compound, said organometallic compound being either admixed or encapsulated with said thermoplastic resin, allows obtaining of a cured body not subject to decrease in hardness with the lapse of time during storage of the composition, and forms cured body exhibiting excellent adhesion to various substrates by heating.
Inventors:
Toshiki Nakata
Masayuki Onishi
Oozaki saki Koichi
Masayuki Onishi
Oozaki saki Koichi
Application Number:
JP2004181741A
Publication Date:
July 27, 2011
Filing Date:
June 18, 2004
Export Citation:
Assignee:
DOW CORNING CORPORATION
International Classes:
C08L83/07; C08K5/00; C08K5/098; C08K5/541; C08K9/04; C08K9/10; C08L83/04; C08L83/05
Domestic Patent References:
| JP9111125A | ||||
| JP4246466A | ||||
| JP4222871A | ||||
| JP6157913A |