Title:
硬化性ポリオルガノシロキサン組成物、当該組成物を硬化することにより得られる硬化体、およびそれを含む電子デバイス
Document Type and Number:
Japanese Patent JP7280253
Kind Code:
B2
Abstract:
The present disclosure relates to a light curable, light-heat or light-moisture dually curable, or light-heat-moisture multiple curable polyorganosiloxane composition, which has ease of synthesis, low volatile content, rapid curability, excellent toughness and/or superior optical/physical stability in a variety of fields such as coating materials, encapsulants, sealants and adhesives, a cured body obtained by curing said compositions, and an electronic device comprising the same.
Inventors:
Takuya Ogawa
Park, Yunjin
Yuku, Chuyoung
Park, Yunjin
Yuku, Chuyoung
Application Number:
JP2020522932A
Publication Date:
May 23, 2023
Filing Date:
October 26, 2018
Export Citation:
Assignee:
Dow Silicones Corporation
Dow Toray Co., Ltd.
Dow Toray Co., Ltd.
International Classes:
C08L83/07; C09D183/07; C09J183/07
Domestic Patent References:
| JP2017171734A | ||||
| JP2013203794A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe
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