Title:
硬化性樹脂組成物、および硬化膜
Document Type and Number:
Japanese Patent JP7413762
Kind Code:
B2
Abstract:
To provide a curable resin composition excellent in adhesion by low-temperature heating and also excellent in storage stability, and to provide a cured film.SOLUTION: The curable resin composition contains a basic resin (A), an alkali-soluble resin (B), a photopolymerizable monomer (C), and a photopolymerization initiator (D) and does not contain an organic pigment and carbon black. The basic resin (A) preferably has an amine value of 30-350 mg KOH/g. The alkali-soluble resin (B) preferably has an acid value of 30-130 mg KOH/g.SELECTED DRAWING: None
Inventors:
Toshio Waku
Application Number:
JP2019231207A
Publication Date:
January 16, 2024
Filing Date:
December 23, 2019
Export Citation:
Assignee:
Toyo Ink sc Holdings Co., Ltd.
International Classes:
C08F290/12; C08F2/44; C08F291/00; G02B5/20; G03F7/027; G03F7/031
Domestic Patent References:
| JP2009102484A | ||||
| JP2010085553A | ||||
| JP2016006475A | ||||
| JP2011002694A |
Foreign References:
| WO2006082776A1 |
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