Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE FOR ELECTRONIC COMPONENTS, THERMOSETTING ADHESIVE FILM FOR ELECTRONIC COMPONENTS, AND SEAL AGENT FOR DISPLAY DEVICES
Document Type and Number:
Japanese Patent JP2023127565
Kind Code:
A
Abstract:
To provide a curable resin composition that excels in curability and adhesion to both metal and fluororesin, a cured product of the curable resin composition, and an adhesive for electronic components, a thermosetting adhesive film for electronic components and a seal agent for display devices, each including the curable resin composition.SOLUTION: A curable resin composition includes a curable resin, and a compound (T1) having constitutional units (A-1), (A-1'), (A-2), and (A-2') represented by the following formulae.SELECTED DRAWING: None
Inventors:
SHIMOJITOSHO AKIRA
OGATA TAKEHIRO
OGATA TAKEHIRO
Application Number:
JP2023028632A
Publication Date:
September 13, 2023
Filing Date:
February 27, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08F2/44; C08F20/00; C08F291/00; C08G59/40; C08K3/013; C08L101/00; C09J7/30; C09J11/08; C09J201/00; C09K3/10
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus
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