Title:
CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF, ADHESIVE AND LAMINATE
Document Type and Number:
Japanese Patent JP2023146870
Kind Code:
A
Abstract:
To provide a curable resin composition that excels in thermal conductivity and elongation after curing, and can be used as a low-viscosity, room-temperature-curable, two-component or multi-component adhesive.SOLUTION: A curable resin composition includes a first component including epoxy resin (A), and a second component including a specific epoxy curing agent (D). The curable resin composition further includes a polymer particle (B) with a core-shell structure including a core layer and a shell layer, and aluminum oxide (C) with a specific average particle size. The aluminum oxide (C) is contained in a specific amount.SELECTED DRAWING: None
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Inventors:
OKAMOTO TOSHIHIKO
Application Number:
JP2022054291A
Publication Date:
October 12, 2023
Filing Date:
March 29, 2022
Export Citation:
Assignee:
KANEKA CORP
International Classes:
C08L63/00; C08K3/22; C08K5/17; C08L51/00; C09J11/04; C09J11/06; C09J11/08; C09J109/02; C09J163/00; C09J171/00
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK